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Status published
High
CVE-2025-47373
Out-of-bounds Write in Automotive
Vulnerability Description
Memory Corruption when accessing buffers with invalid length during TA invocation.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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CVE-2025-59614
Out-of-bounds Write in Windows Compute
Medium
6.7
CVE-2025-59613
Stack-based Buffer Overflow in Windows Compute
Medium
6.7
Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
AR8035, Cologne, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, FWA Gen 3 Ultra Platform, G1 Gen 1, G2 Gen 1, IQ6 Series Platform, IQ8 Series Platform, IQ9 Series Platform, LeMans_AU_LGIT, LeMansAU, Milos, Monaco_IOT, Netrani, Orne, Palawan25, Pandeiro, QAM8255P, QAM8295P, QAM8620P, QAMSRV1H, QAMSRV1M, QCA0000, QCA6174A, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6678AQ, QCA6688AQ, QCA6696, QCA6698AQ, QCA6698AU, QCA6797AQ, QCA8081, QCA8337, QCA8695AU, QCC710, QCM4325, QCM4490, QCM5430, QCM6490, QCN6224, QCN6274, QCN9011, QCN9012, QCS4290, QCS4490, QCS8550, QDX1010, QDX1011, QEP8111, QFW7114, QFW7124, QLN1083BD, QLN1086BD, QMP1000, QPA1083BD, QPA1086BD, QRU1032, Qualcomm Dragonwing QRU100 Platform, Qualcomm Dragonwing X100 Accelerator Card, Qualcomm Video Collaboration VC3 Platform, QXM1083, QXM1086, QXM1093, QXM1094, QXM1095, QXM1096, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8770P, SA9000P, SAR1165P, SAR1250P, SAR2130P, SAR2230P, SC8380XP, SD 8 Gen1 5G, SD662, SM6225P, SM6650P, SM7435, SM7550, SM7550P, SM7635P, SM7675, SM7675P, SM8475P, SM8550P, SM8635, SM8635P, SM8650Q, SM8750P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform, Snapdragon 6 Gen 1 Mobile Platform, Snapdragon 6 Gen 3 Mobile Platform, Snapdragon 6 Gen 4 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 7 Gen 1 Mobile Platform, Snapdragon 7+ Gen 2 Mobile Platform, Snapdragon 7s Gen 3 Mobile Platform, Snapdragon 8 Elite, Snapdragon 8 Elite Gen 5, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR1 Gen 1 Platform, Snapdragon AR1+ Gen 1 Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon X32 5G Modem-RF System, Snapdragon X35 5G Modem-RF System, Snapdragon X72 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, SRV1H, SRV1L, SRV1M, SW6100, SW6100P, SXR2230P, SXR2250P, SXR2330P, SXR2350P, Themisto, WCD9340, WCD9370, WCD9371, WCD9375, WCD9378, WCD9378C, WCD9380, WCD9385, WCD9390, WCD9395, WCN3910, WCN3950, WCN3988, WCN6450, WCN6650, WCN6755, WCN7860, WCN7861, WCN7880, WCN7881, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H, X2000077, X2000086, X2000090, X2000092, X2000094, XG101002, XG101032, XG101039
Timeline
Official Publish:
March 2nd, 2026
Last Modified:
March 2nd, 2026
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H