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Status published
Medium
CVE-2025-47363
Integer Overflow or Wraparound in Automotive
Vulnerability Description
Memory corruption when calculating oversized partition sizes without proper checks.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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CVE-2025-59613
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Medium
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
QAM8255P, QAM8295P, QAM8620P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6574AU, QCA6595, QCA6595AU, QCA6688AQ, QCA6696, QCA6698AQ, QCA6797AQ, QCA8695AU, SA6145P, SA6150P, SA6155P, SA7255P, SA7775P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8620P, SA8650P, SA8770P, SA8775P, SA9000P, SRV1H, SRV1L, SRV1M
Timeline
Official Publish:
February 2nd, 2026
Last Modified:
February 26th, 2026
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H