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Status published
High
CVE-2025-47324
Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware
Vulnerability Description
Information disclosure while accessing and modifying the PIB file of a remote device via powerline.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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CVE-2025-59614
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CVE-2025-59613
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Medium
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
QCA7005
Timeline
Official Publish:
August 6th, 2025
Last Modified:
August 6th, 2025
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Weaknesses (CWE)
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.