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Status published
High
CVE-2025-27056
Use After Free in DSP Service
Vulnerability Description
Memory corruption during sub-system restart while processing clean-up to free up resources.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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CVE-2025-59614
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Medium
6.7
CVE-2025-59613
Stack-based Buffer Overflow in Windows Compute
Medium
6.7
Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
FastConnect 7800, QMP1000, SM8735, SM8750, SM8750P, Snapdragon 8 Gen 3 Mobile Platform, Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, SXR2330P, WCD9378, WCD9380, WCD9390, WCD9395, WCN7750, WCN7860, WCN7861, WCN7880, WCN7881, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Timeline
Official Publish:
July 8th, 2025
Last Modified:
July 8th, 2025
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H