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Status published
Medium
CVE-2024-23374
Stack-based Buffer Overflow in Power Management IC
Vulnerability Description
Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
FastConnect 6900, FastConnect 7800, QCA6174A, QCA6574AU, QCA6584AU, QCA6696, QCA6698AQ, QCA9367, QCA9377, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, WCD9380, WCN3980, WCN3988, WSA8830, WSA8835
Timeline
Official Publish:
October 7th, 2024
Last Modified:
October 7th, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H