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Status published
High
CVE-2024-21454
Integer Overflow to Buffer Overflow in Automotive Telematics
Vulnerability Description
Transient DOS while decoding the ToBeSignedMessage in Automotive Telematics.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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CVE-2025-59614
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CVE-2025-59613
Stack-based Buffer Overflow in Windows Compute
Medium
6.7
Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
C-V2X 9150, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 4G Modem
Timeline
Official Publish:
April 1st, 2024
Last Modified:
August 1st, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Weaknesses (CWE)
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.