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Status published
High
CVE-2023-33092
Buffer Copy Without Checking Size of Input in Bluetooth HOST
Vulnerability Description
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6310, QCA6320, QCA6391, QCA6420, QCA6430, QCM4325, QCM4490, QCM5430, QCM6490, QCM8550, QCS4490, QCS5430, QCS6490, QCS7230, QCS8250, QCS8550, Qualcomm 215 Mobile Platform, Qualcomm Video Collaboration VC3 Platform, Qualcomm Video Collaboration VC5 Platform, SD730, SD835, SD855, SD888, SG4150P, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon X55 5G Modem-RF System, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3615, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H
Timeline
Official Publish:
December 5th, 2023
Last Modified:
May 29th, 2025
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H