CVE-2023-33038 - CVE House
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Status published Medium CVE-2023-33038

Integer Overflow or Wraparound in Radio Interface Layer

Vulnerability Description

Memory corruption while receiving a message in Bus Socket Transport Server.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Qualcomm, Inc.

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Affected Software

Snapdragon
Vulnerable Versions:
AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8295P, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCS410, QCS610, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD 8 Gen1 5G, SD855, SD865 5G, SM4450, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9341, WCD9370, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

Timeline

Official Publish: January 2nd, 2024
Last Modified: November 14th, 2024
Added to House: July 22nd, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)