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Status published
High
CVE-2023-33034
Signed-to-unsigned conversion error in Audio
Vulnerability Description
Memory corruption while parsing the ADSP response command.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6900, Flight RB5 5G Platform, QAM8295P, QCA6391, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCM6490, QCN9011, QCN9012, QCS410, QCS610, QCS6490, QRB5165M, QRB5165N, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD888, SM7315, SM7325P, Smart Audio 400 Platform, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835
Timeline
Official Publish:
October 3rd, 2023
Last Modified:
February 27th, 2025
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weaknesses (CWE)
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.