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Status published
Medium
CVE-2023-28577
Multiple Dmabuf Kernel Address UAF Vulnerability
Vulnerability Description
In the function call related to CAM_REQ_MGR_RELEASE_BUF there is no check if the buffer is being used. So when a function called cam_mem_get_cpu_buf to get the kernel va to use, another thread can call CAM_REQ_MGR_RELEASE_BUF to unmap the kernel va which cause UAF of the kernel address.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6391, QCA6426, QCA6436, QCN9074, QCS410, QCS610, SD865 5G, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9341, WCD9370, WCD9380, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835
Timeline
Official Publish:
August 8th, 2023
Last Modified:
August 2nd, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H