CVE-2023-26073 - CVE House
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Status published High CVE-2023-26073

An issue was discovered in Samsung Mobile Chipset and Baseband...

Vulnerability Description

An issue was discovered in Samsung Mobile Chipset and Baseband Modem Chipset for Exynos 850, Exynos 980, Exynos 1080, Exynos 1280, Exynos 2200, Exynos Modem 5123, Exynos Modem 5300, and Exynos Auto T5123. A heap-based buffer overflow in the 5G MM message codec can occur due to insufficient parameter validation when decoding the extended emergency number list.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Affected Software

Unknown
Vulnerable Versions:
Unknown

Timeline

Official Publish: March 13th, 2023
Last Modified: March 3rd, 2025
Added to House: July 22nd, 2026

CVSS Vectors

V3: CVSS:3.1/AC:L/AV:N/A:H/C:L/I:L/PR:L/S:U/UI:N

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.