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Status published
Medium
CVE-2023-22668
Use After Free in Audio
Vulnerability Description
Memory Corruption in Audio while invoking IOCTLs calls from the user-space.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
AQT1000, AR8035, FastConnect 6200, FastConnect 6800, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8775P, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6584AU, QCA6698AQ, QCA8081, QCA8337, QCC710, QCN6224, QCN6274, QFW7114, QFW7124, Qualcomm 205 Mobile Platform, Qualcomm 215 Mobile Platform, SA8255P, SA8770P, SA8775P, SA9000P, SD855, SD865 5G, Snapdragon 210 Processor, Snapdragon 212 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9340, WCD9341, WCD9380, WCN3610, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835
Timeline
Official Publish:
December 5th, 2023
Last Modified:
February 25th, 2026
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H