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Status published
High
CVE-2023-21672
Use After Free in Audio
Vulnerability Description
Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCM4325, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD 8 Gen1 5G, SD865 5G, SG4150P, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon XR2 5G Platform, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2230P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835
Timeline
Official Publish:
July 4th, 2023
Last Modified:
August 2nd, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H