CVE-2023-21671 - CVE House
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Status published Critical CVE-2023-21671

Improper Input Validation in Core

Vulnerability Description

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Qualcomm, Inc.

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Affected Software

Snapdragon
Vulnerable Versions:
FastConnect 6700, FastConnect 6900, QCA6391, QCM6490, QCS6490, QSM8350, Qualcomm Video Collaboration VC3 Platform, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WSA8830, WSA8835

Timeline

Official Publish: November 7th, 2023
Last Modified: February 27th, 2025
Added to House: July 22nd, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H

Weaknesses (CWE)