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Status published
Medium
CVE-2023-21648
Integer Overflow to Buffer Overflow in RIL
Vulnerability Description
Memory corruption in RIL while trying to send apdu packet.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
AQT1000, QCA6391, QCA6420, QCA6430, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCC5100, SA515M, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD855, SDA429W, SDX55, SW5100, SW5100P, WCD9341, WCD9360, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3988, WCN3998, WSA8810, WSA8815, WSA8830, WSA8835
Timeline
Official Publish:
August 8th, 2023
Last Modified:
August 2nd, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Weaknesses (CWE)
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.