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Status published
Medium
CVE-2023-21639
Buffer Copy Without Checking the Size of Input in Audio
Vulnerability Description
Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon
Vulnerable Versions:
AQT1000, FastConnect 6200, QCA6420, QCA6430, SA4150P, SA4155P, SA6155P, SA8155P, SA8195P, SD855, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, WCD9341, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835
Timeline
Official Publish:
July 4th, 2023
Last Modified:
August 2nd, 2024
Added to House:
July 22nd, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H