CVE-2023-21624 - CVE House
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Status published Medium CVE-2023-21624

Information Exposure in DSP Services

Vulnerability Description

Information disclosure in DSP Services while loading dynamic module.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Qualcomm, Inc.

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Affected Software

Snapdragon
Vulnerable Versions:
FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8255P, QCA6310, QCA6320, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCS8155, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SD835, SD865 5G, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 835 Mobile PC Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835

Timeline

Official Publish: July 4th, 2023
Last Modified: August 2nd, 2024
Added to House: July 22nd, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N

Weaknesses (CWE)