CVE-2022-33292 - CVE House
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Status published High CVE-2022-33292

Use after free in Qualcomm IPC

Vulnerability Description

Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Qualcomm, Inc.

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Affected Software

Snapdragon
Vulnerable Versions:
SG4150P, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), WCD9370, WCD9375, WCN3950, WCN3988, WSA8810

Timeline

Official Publish: May 2nd, 2023
Last Modified: August 3rd, 2024
Added to House: July 21st, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)