CVE-2022-33263 - CVE House
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Status published Medium CVE-2022-33263

Use after free in Core

Vulnerability Description

Memory corruption due to use after free in Core when multiple DCI clients register and deregister.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

Affected Vendor

Qualcomm, Inc.

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Affected Software

Snapdragon
Vulnerable Versions:
AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QCA6420, QCA6430, QCA6574AU, QCA6595AU, QCA6698AQ, QCA6797AQ, QCS8155, SA6155P, SA8155P, SA8195P, SA8255P, SD 8 Gen1 5G, SD855, SM4450, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, SW5100, SW5100P, WCD9341, WCD9370, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

Timeline

Official Publish: June 6th, 2023
Last Modified: January 7th, 2025
Added to House: July 21st, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)