CVE-2021-30308 - CVE House
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Status published High CVE-2021-30308

Possible buffer overflow while printing the HARQ memory partition detail...

Vulnerability Description

Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

References

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Affected Vendor

Qualcomm, Inc.

View all reports →

Affected Software

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Vulnerable Versions:
AQT1000, AR8035, CSRB31024, FSM10056, MDM9150, MDM9250, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCS410, QCS603, QCS605, QCS610, QCX315, SA415M, SA515M, SD 675, SD 8 Gen1 5G, SD 8cx Gen2, SD480, SD660, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD7c, SD845, SD850, SD855, SD865 5G, SD870, SDX12, SDX20, SDX24, SDX55, SDX55M, SDX65, SDXR1, SDXR2 5G, SM6250, SM6250P, SM6375, SM7250P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835

Timeline

Official Publish: January 13th, 2022
Last Modified: August 3rd, 2024
Added to House: July 21st, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.