CVE-2019-19196 - CVE House
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Status published Medium CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on...

Vulnerability Description

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

References

More from telink-semi

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CVE-2019-19194
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on...
High 8.8

Affected Vendor

telink-semi

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Affected Software

tlsr8258 ble sdk, tlsr8269 ble sdk, tlsr8253 ble sdk, tlsr8251 ble sdk, tlsr8232 ble sdk
Vulnerable Versions:
0

Timeline

Official Publish: February 12th, 2020
Last Modified: August 5th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.