CVE-2019-15364 - CVE House
Back to Database
Status published Medium CVE-2019-15364

The Dexp BL250 Android device with a build fingerprint of...

Vulnerability Description

The Dexp BL250 Android device with a build fingerprint of DEXP/BL250/BL250:8.1.0/O11019/1530858027:user/release-keys contains a pre-installed app with a package name of com.mediatek.wfo.impl app (versionCode=27, versionName=8.1.0) that allows any app co-located on the device to modify a system property through an exported interface without proper authorization.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

THREAT MONITOR

Am I Vulnerable?

Launch our assessment wizard to check if your infrastructure is exposed to • CVE-2019-15364

Credits & Attribution

No credits recorded in the NVD database.

References

More from dexp

View All →
CVE-2019-15358
The Dexp Z250 Android device with a build fingerprint of...
Medium 5.5

Affected Vendor

Affected Software

bl250 firmware
Vulnerable Versions:
Unknown

Timeline

Official Publish: November 14th, 2019
Last Modified: August 5th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:H/A:N

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.