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Status published
High
CVE-2019-14051
Subsequent additions performed during Module loading while allocating the memory...
Vulnerability Description
Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon Industrial IOT
Vulnerable Versions:
MDM9206, MDM9607
Timeline
Official Publish:
February 7th, 2020
Last Modified:
August 5th, 2024
Added to House:
July 20th, 2026
CVSS Vectors
V3:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weaknesses (CWE)
No CWE data available
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.