CVE-2019-10625 - CVE House
Back to Database
Status published High CVE-2019-10625

Out of bound access in diag services when DCI command...

Vulnerability Description

Out of bound access in diag services when DCI command buffer reallocation is not done properly with required capacity in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

THREAT MONITOR

Am I Vulnerable?

Launch our assessment wizard to check if your infrastructure is exposed to • CVE-2019-10625

Credits & Attribution

No credits recorded in the NVD database.

References

More from Qualcomm, Inc.

View All →
CVE-2025-59617
Use After Free in Computer Vision
Medium 6.6
CVE-2025-59616
Use After Free in Computer Vision
Medium 6.6
CVE-2025-59615
Use After Free in Computer Vision
Medium 6.6
CVE-2025-59614
Out-of-bounds Write in Windows Compute
Medium 6.7
CVE-2025-59613
Stack-based Buffer Overflow in Windows Compute
Medium 6.7

Affected Vendor

Qualcomm, Inc.

View all reports →

Affected Software

Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Vulnerable Versions:
APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150

Timeline

Official Publish: April 16th, 2020
Last Modified: August 4th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.