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Status published
Critical
CVE-2018-5878
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer...
Vulnerability Description
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vulnerable Versions:
MDM9206, MDM9607, MDM9635M, MDM9650, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 625, SD 835
Timeline
Official Publish:
July 6th, 2018
Last Modified:
September 16th, 2024
Added to House:
July 20th, 2026
CVSS Vectors
V3:
CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Weaknesses (CWE)
No CWE data available
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.