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Status published
High
CVE-2018-11862
Buffer overflow can happen in WLAN module due to lack...
Vulnerability Description
Buffer overflow can happen in WLAN module due to lack of validation of the input length in Snapdragon Mobile in version SD 845, SD 850, SDA660.
Impact Analysis
Refer to official advisory for detailed impact metrics.
Remediation
Ensure systems are updated to the latest vendor-supplied patch levels.
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Credits & Attribution
No credits recorded in the NVD database.
References
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Affected Vendor
Qualcomm, Inc.
View all reports →Affected Software
Snapdragon Mobile
Vulnerable Versions:
SD 845, SD 850, SDA660
Timeline
Official Publish:
October 29th, 2018
Last Modified:
August 5th, 2024
Added to House:
July 20th, 2026
CVSS Vectors
V3:
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weaknesses (CWE)
No CWE data available
MITRE ATT&CK TTPs
No associated TTPs found for this vulnerability.