CVE-2018-11277 - CVE House
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Status published High CVE-2018-11277

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD...

Vulnerability Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

References

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Affected Vendor

Qualcomm, Inc.

View all reports →

Affected Software

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vulnerable Versions:
MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660

Timeline

Official Publish: September 20th, 2018
Last Modified: August 5th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.