CVE-2018-11264 - CVE House
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Status published High CVE-2018-11264

Possible buffer overflow in Ontario fingerprint code due to lack...

Vulnerability Description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

References

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Affected Vendor

Qualcomm, Inc.

View all reports →

Affected Software

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vulnerable Versions:
MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660

Timeline

Official Publish: November 28th, 2018
Last Modified: August 5th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.