CVE-2016-2063 - CVE House
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Status published High CVE-2016-2063

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in...

Vulnerability Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Impact Analysis

Refer to official advisory for detailed impact metrics.

Remediation

Ensure systems are updated to the latest vendor-supplied patch levels.

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Credits & Attribution

No credits recorded in the NVD database.

References

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Affected Vendor

Affected Software

linux kernel
Vulnerable Versions:
3.0

Timeline

Official Publish: August 7th, 2016
Last Modified: August 5th, 2024
Added to House: July 20th, 2026

CVSS Vectors

V3: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weaknesses (CWE)

No CWE data available

MITRE ATT&CK TTPs

No associated TTPs found for this vulnerability.